The 3-Tier PCB library concept was originally created by IEC (International Electromechanical Commission) in 1999 and introduced to IPC in 2000. The concept had to be created as a solution for high density packaging for hand held devices to ruggedized military applications and everything in-between. The IPC-7351 and the IEC 61188-5-1 SMT land pattern standards [...]![]()
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